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IEC 61189-3:1997 ed1.0
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
105 стр.
Заменен
Электронный (pdf)Печатная копия
491.40 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.180 Printed circuits and boards / Печатные схемы и платы
Описание
Provides a catalogue of test methods representing methodologies andprocedures that can be applied to test materials used formanufacturing interconnection structures (printed boards) andassemblies. It mainly covers chemical, mechanical and electricaltest methods.