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IEC 61190-1-1:2002 ed1.0
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
41 стр.
Действует
Электронный (pdf)Печатная копия
229.32 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.190 Electronic. Including preassembled modules / Электронные компоненты в сборе. Включая предварительно собранные модули
Описание
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.