(812) 309-78-59
(495) 223-46-76
IEC 61191-3:1998 ed1.0
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
31 стр.
Заменен
Электронный (pdf)Печатная копия
131.04 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.240 Mechanical structures for electronic equipment / Механические конструкции электронного оборудования
Описание
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).