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OVE EN IEC 61191-1:2019-07
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018) (english version)
Действует
Печатная копияПечатное издание
397.55 € (включая НДС 20%)
Разработчик:
Зарубежные/ON
ICS:
31.190 Electronic. Including preassembled modules / Электронные компоненты в сборе. Включая предварительно собранные модули, 31.240 Mechanical structures for electronic equipment / Механические конструкции электронного оборудования
Описание
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria
for producing quality soldered interconnections and assemblies using surface mount and
related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.