This specification establishes the requirements for electrodeposited gold coatings for engineering applications, employed specifically for their corrosion and tarnish resistance (including resistance to fretting corrosion and catalytic polymerization), bondability, low and stable contact resistance, solderability, and infrared reflectivity. This specification does not cover gold coatings produced from autocatalytic, immersion, and vapor deposition. Coatings shall be classified into types, which characterize minimum purity, and codes, which designate Knoop hardness. Coatings shall be sampled, tested and conform to specified requirements as to purity, hardness, appearance, thickness, mass per unit area, ductility, adhesion (assessed by either bend, heat, or cutting test), and integrity (including gross defects, mechanical damage, and porosity).
Область применения1.1 This specification covers requirements for electrodeposited gold coatings that contain not less than 99.00 mass % gold and that are used for engineering applications.
1.2 Specifically excluded from this specification are autocatalytic, immersion, and vapor deposited gold coatings.
1.3 Gold coatings conforming to this specification are employed for their corrosion and tarnish resistance (including resistance to fretting corrosion and catalytic polymerization), bondability, low and stable contact resistance, solderability, and infrared reflectivity. Several types of coatings, differing in gold purity and hardness, are covered by this specification.
1.4 The values stated in SI units are to be regarded as the standard. Values provided in parentheses are for information only.
1.5 The following hazards caveat pertains only to the test methods section, Section 9, of this specification: This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.