This specification establishes the requirements for electrodeposited copper coatings used for engineering purposes including surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interference shielding in electronic circuitry, and in certain joining operations. This specification does not cover electrodeposited copper used as a decorative finish, as an undercoat for other decorative finishes, or for electroforming. Coatings shall be classified according to thickness. Metal parts shall undergo pre- and post-coating treatment for reducing the risk of hydrogen embrittlement, and peening. Coatings shall be sampled, tested, and shall conform to specified requirements as to appearance, thickness, porosity, solderability, adhesion, embrittlement relief, and packaging.

1.1 This specification covers requirements for electrodeposited coatings of copper used for engineering purposes. Examples include surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interferences (EMI) shielding in electronic circuitry, and in certain joining operations.

1.2 This specification is not intended for electrodeposited copper when used as a decorative finish, or as an undercoat for other decorative finishes.

1.3 This specification is not intended for electrodeposited copper when used for electroforming.