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ASTM D1674-67(1977)

Отменен
Methods of Testing Polymerizable Embedding Compounds Used for Electrical Insulation (Withdrawn 1990) — 18 стр.
ОписаниеСсылкиВерсии

Ссылочные документы

ASTM D1674-67(1977)
Отменен
Methods of Testing Polymerizable Embedding Compounds Used for Electrical Insulation (Withdrawn 1990) — 18 стр.

На этот документ ссылаются

SAE AMS3731C
Действует
Potting Compound, Epoxy Bisphenol A-Type
SAE AMS3731B
Заменен
POTTING COMPOUND, EPOXY Bisphenol A-Type (Noncurrent: Jan 1993)
SAE AMS3731/10C
Действует
POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible (Stabilized: Nov 2017)
SAE AMS3731/10B
Заменен
POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible (Noncurrent: Jan 1993)
SAE AMS3731/9B
Заменен
POTTING COMPOUND, EPOXY Flexible, Thermal Shock Resistant, Heat Cure (Noncurrent: Jan 1993)
SAE AMS3731/9C
Действует
Potting Compound, Epoxy Flexible, Thermal Shock Resistant, Heat Cure
SAE AMS3731/6B
Заменен
POTTING COMPOUND, EPOXY Bisphenol A-Type Syntactic Foam, Heat Cure (Noncurrent: Jan 1993)
SAE AMS3731/6C
Действует
Potting Compound, Epoxy Bisphenol A-Type Syntactic Foam, Heat Cure
SAE AMS3731/5C
Действует
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm
SAE AMS3731/4B
Заменен
POTTING COMPOUND, EPOXY Bisphenol A-Type Impregnating Resin, Heat Cure, Single Component (Noncurrent: Jan 1993)
SAE AMS3731/7B
Заменен
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage (Noncurrent: Jan 1993)
SAE AMS3731/1C
Действует
Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure
SAE AMS3731/5B
Заменен
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm (Noncurrent: Jan 1993)
SAE AMS3731/8B
Заменен
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Heat Cure, High HDT (Noncurrent: Jan 1993)
SAE AMS3731/8C
Действует
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, High HDT
SAE AMS3731/4C
Действует
Potting Compound, Epoxy Bisphenol A-Type Impregnating Resin, Heat Cure, Single Component
SAE AMS3731/3C
Действует
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Machinable
SAE AMS3731/3B
Заменен
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Heat Cure, Machinable (Noncurrent: Jan 1993)
SAE AMS3731/1B
Заменен
POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure (Noncurrent: Jan 1993)
SAE AMS3731/7C
Действует
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
ASTM D229-19
Заменен
Standard Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation — 18 стр.
ASTM D229-09
Заменен
Standard Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation — 17 стр.
ASTM D229-09b
Заменен
Standard Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation — 18 стр.
ASTM D229-13
Заменен
Standard Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation — 18 стр.
ASTM D229-09a
Заменен
Standard Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation — 17 стр.
ASTM D229-96
Заменен
Standard Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation — 16 стр.
ASTM D229-01
Заменен
Standard Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation — 16 стр.
ASTM D229-19e1
Действует
Standard Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation — 18 стр.
ASTM D1674-67(1977)
Отменен
Methods of Testing Polymerizable Embedding Compounds Used for Electrical Insulation (Withdrawn 1990) — 18 стр.