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1.1 These test methods cover procedures for testing film-insulated magnet wire that is used in electrical apparatus. These test methods are intended primarily for the evaluation of the electrical insulating materials used. The intent is that these test methods be used, except where modified, by individual specifications for particular applications.

1.2 These test methods present different procedures for evaluating given properties of round, rectangular or square, copper or aluminum film-insulated magnet wire.

1.3 The values stated in inch-pound units are the standard. The SI units in parentheses are provided for information only.

1.4 The test methods appear in the following sections:

SectionsBond Strength4-12Burnout (AC Overload Resistance)13-21Chemical Resistance22-28Coefficient of Friction29-37Continuity, DC High Voltage38-45Continuity, DC Low Voltage46-53Completeness of Cure54-60Cut-Through Temperature (Thermoplastic Flow)61-68Dielectric Breakdown AC Voltage69-75Dielectric Breakdown AC Voltage after Bending76-82Dielectric Breakdown AC Voltage at Elevated Temperatures83-89Dielectric Breakdown AC Voltage after Conditioning in Refrigerant Atmosphere90-99Dimensional Measurement100-106Dissipation Factor Measurement107-114Electrical Resistance115-121Elongation122-129Extractables, Refrigerant130-140Film Adherence and Flexibility141-148Formability:a) Elastic Ratio152b) Low Stress Elongation153c) Spring Back154-155Heat Shock156-162Oiliness163-169Scrape Resistance, Unidirectional170-177Solderability178-185Resistance to Insulating Liquids and Hydrolytic Stability186-195

1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. Specific hazard statements are given in 9.5, 19.1, 19.3, 19.8, 52.1, 58, 59.1, 74.1, 112.1, 135.4, and 182.3 .

Note 1—This test method is related to IEC 60851. Since both methods contain multiple test procedures, many procedures are technically equivalent while others differ significantly.