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ASTM D1867-13

Отменен
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020) — 5 стр.
Причина отмены This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces.

Formerly under the jurisdiction of Committee D09 on Electrical and Electronic Insulating Materials, this specification was withdrawn in March 2020. This standard is being withdrawn without replacement because it is no longer being maintained.

Реферат

This specification covers twelve grades of thermosetting laminate with copper foil cladded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. The laminates shall meet the following requirements: peel strength after solder float and at elevated temperature conditions; lengthwise and crosswise flexural strengths; flammability rating; water absorption; volume resistivity; dielectric breakdown parallel to laminations; dissipation factor; and permittivity. Warp or twist, and blistering requirements shall also be tested for conformance.

Область применения

1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

ICS
31.180 Printed circuits and boards / Печатные схемы и платы
Сборник ASTM
10.01 Electrical Insulation (I): D69–D2484 / Электрическая изоляция (I): D69-D2484
Тематика
Electrical Insulating Materials