This test method is useful in research and development for comparison of creep properties of adhesives, particularly as those properties are affected by changes in adhesive formulation or expected service conditions, including temperature, moisture level, and duration of loading.

The relative size and simplicity of design of the spring-loaded apparatus permits easy portability and transfer from one environment to the next without disturbing static loads.

The relative simplicity of design with inexpensive materials permits replication of creep tests at relatively low costs.

1.1 This test method covers the determination of the creep properties of adhesives for bonding metals when tested on a standard specimen and subjected to certain conditions of temperature and tensile stress in a spring-loaded testing apparatus.

1.2 This test method is applicable to the temperature range from −55 to +260°C (−67 to +500°F).

1.3 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.