4.1 This test determines the compressive creep under laboratory conditions or under conditions that are possibly encountered during manufacture of electrical equipment. It has special significance if the material to be tested is applied as commutator segment insulation. It serves as a measure under specified conditions of the ability of the material to resist deformation while under compressive load, during exposure to elevated temperature for a specified time. This test is suitable for acceptance tests and for manufacturing control.

1.1 These test methods cover the testing of bonded mica splittings and bonded mica paper to be used for commutator insulation, hot molding, heater plates, and other similar insulating purposes.

1.2 These test methods appear in the following sections:

Test

Sections

Compressive Creep

4 – 10

Dielectric Strength

38 – 41

Mica or Binder Content

19

Molding Test

31 – 36

Organic Binder

20 – 24

Resistivity

42 – 46

Silicone Binder

25 – 30

Stability Under Heat and Pressure

11 – 18

1.3 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. See 40.1 and 45.1 for specific hazard statements.

1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.