This is a laboratory test designed to simulate the effects of (1) the presence of rough interfaces between conductor or semiconductive screen and primary insulation in an insulation system, (2) the presence of foreign particles (contaminants) in an insulation system, and (3) the presence of small voids or cavities within the insulation.

This test method provides comparative data. The degree of correlation with actual performance in service has not been established.

1.1 This test method covers the evaluation and comparison of the resistance of solid organic dielectric materials to the initiation or growth, or both, of tubular tree-like channels resulting from partial discharge (corona) and molecular decomposition that occur in the region of very high, diverging electric fields. ^,

1.2 This test method is primarily for use at a power frequency of 50 or 60 Hz.

1.3 The test may be carried out at room temperature or temperatures above or below room temperature. The temperature should not exceed the softening or melting point of the sample material.

1.4 This test method can be used for any solid material into which needles can be cast, molded, or inserted with heat after molding. The resistance to tree initiation is measured by the double-needle characteristic voltage, which is only applicable to non-opaque materials so that tree can be observed optically. The resistance to tree initiation and growth is reported by the double-needle voltage life, which is applicable to both opaque and non-opaque materials.

1.5 The values stated in SI units are to be regarded as the standard.

1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.