Причина отмены These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

Formerly under the jurisdiction of Committee D09 on Electrical and Electronic Insulating Materials, these test methods were withdrawn in March 2020. This standard is being withdrawn without replacement because it is no longer being maintained.

Реферат

These test methods establish the standard procedures for testing copper-clad laminates produced from fiber-reinforced thermosetting polymeric materials intended for fabrication of printed wiring boards. The properties that these test methods shall examine are as follows: dielectric breakdown voltage parallel to laminations; dimensional instability; dissipation factor; flammability rating; flatwise flexural strength at room and elevated temperatures; behavior during oven blister test; peel strength at room and elevated temperatures; permittivity; pin holes and scratches in copper surface; purity of copper; behavior upong solder float test; solvent resistance; surface and volume resistivity; thickness; warp or twist; and water absorption.

Область применения

1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

1.2 The procedures appear in the following sections:

Procedure

Section

 Referenced Documents

2

 Conditioning

4

 Dielectric Breakdown Voltage Parallel to Laminations

13

 Dimensional Instability

19

 Dissipation Factor

14

 Flammability Rating Test

16

 Flexural Strength, Flatwise at Elevated Temperature

15

 Flexural Strength, Flatwise at Room Temperature

15

 Oven Blister Test

17

 Peel Strength Test at Elevated Temperature

10

 Peel Strength Test at Room Temperature

9

 Permittivity

14

 Pin Holes in Copper Surface

20

 Purity of Copper

5

 Scratches in Copper Surface

21

 Solder Float Test

8

 Solvent Resistance

7

 Surface Resistivity

11

 Volume Resistivity

11

 Terminology

3

 Thickness & Thickness Variation

18

 Warp or Twist

6

 Water Absorption

12

1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.