Methods and procedures used in installing bonded resistance strain gages can have significant effects upon the performance of those sensors. Optimum and reproducible detection of surface deformation requires appropriate and consistent surface preparation, mounting procedures, and verification techniques.

1.1 This document provides guidelines for installing bonded resistance strain gages. It is not intended to be used for bulk or diffused semiconductor gages. This document pertains only to adhesively bonded strain gages.

1.2 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.