1.1 This test method covers a procedure for measuring in-plane lengths (including deflections) of patterned thin films. It applies only to films, such as found in microelectromechanical systems (MEMS) materials, which can be imaged using an interferometer.

1.2 There are other ways to determine in-plane lengths. Using the design dimensions typically provides more precise in-plane length values than using measurements taken with an optical interferometer. (Interferometric measurements are typically more precise than measurements taken with an optical microscope.) This test method is intended for use when interferometric measurements are preferred over using the design dimensions (for example, when measuring in-plane deflections and when measuring lengths in an unproven fabrication process).

1.3 This test method uses a non-contact optical interferometer with the capability of obtaining topographical 3-D data sets. It is performed in the laboratory.

1.4 The maximum in-plane length measured is determined by the maximum field of view of the interferometer at the lowest magnification. The minimum deflection measured is determined by the interferometer's pixel-to-pixel spacing at the highest magnification.

1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.