Formerly under the jurisdiction of Committee F01 on Electronics, this test method was withdrawn in January 2020 in accordance with section 10.6.3 of the Regulations Governing ASTM Technical Committees, which requires that standards shall be updated by the end of the eighth year since the last approval date.

This test method is intended for application in the semiconductor industry for evaluating the purity of materials (for example, sputtering targets, evaporation sources) used in thin film metallization processes. This test method may be useful in additional applications, not envisioned by the responsible technical committee, as agreed upon between the parties concerned.

This test method is intended for use by GDMS analysts in various laboratories for unifying the protocol and parameters for determining trace impurities in copper. The objective is to improve laboratory-to-laboratory agreement of analysis data. This test method is also directed to the users of GDMS analyses as an aid to understanding the determination method, and the significance and reliability of reported GDMS data.

For most metallic species, the detection limit for routine analysis is on the order of 0.01 wt. ppm. With special precautions, detection limits to sub-ppb levels are possible.

This test method may be used as a referee method for producers and users of electronic-grade copper materials.

1.1 This test method covers the concentrations of trace metallic impurities in high purity (99.95 wt. % pure, or purer, with respect to metallic trace impurities) electronic grade copper.

1.2 This test method pertains to analysis by magnetic-sector glow discharge mass spectrometer (GDMS).

1.3 This test method does not include all the information needed to complete GDMS analyses. Sophisticated computer-controlled laboratory equipment, skillfully used by an experienced operator, is required to achieve the required sensitivity. This test method does cover the particular factors (for example, specimen preparation, setting of relative sensitivity factors, determination of detection limits, and the like) known by the responsible technical committee to effect the reliability of high purity copper analyses.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.