Formerly under the jurisdiction of Committee F01 on Electronics, this test method was withdrawn in November 2023. This standard is being withdrawn without replacement because Committee F01 was disbanded.

3.1 Bending of membrane switches, printed electronic device or their components can affect their visual appearance, mechanical integrity or electrical functionality. This test method simulates conditions that may be seen during manufacture, installation or use.

3.2 Bend testing may be destructive, therefore any samples tested should be considered unfit for future use.

3.3 Specific areas of testing include, but are not limited to:

3.3.1 Membrane switch flex tails or printed electronic device, and

3.3.2 Any component of a membrane switch or printed electronic device that may be subjected to bending.

1.1 This test method establishes a method for the bending of any part of a membrane switch or printed electronic device with conductive circuits.

1.1.1 The values given in SI units are to be regarded as the standard. The values given in parentheses are for information only.

1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.