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ASTM F375-89(2010)

Заменен
Standard Specification for Integrated Circuit Lead Frame Material — 3 стр.
Реферат

This specification covers the special requirements for a metal strip used in the fabrication of integrated-circuit lead frames by stamping or photochemical milling. The metal strip shall be manufactured from copper and copper alloys, ferrous alloys containing nickel, cobalt, or chromium, nickel and nickel alloys, or other metallic materials and shall conform to the chemical, physical, and mechanical property requirements specified, including the limitation on the severity and number of inclusions, the surface finish, and the coil size. Tests for straightness, flatness, coil set, and grain size shall be performed and shall conform to the requirements specified.

Область применения

1.1 This specification covers the special requirements for metal strip to be used to fabricate integrated-circuit lead frames by stamping or photochemical milling.

1.2 The metals that are applicable to these parts include copper and copper alloys, ferrous alloys usually containing nickel or cobalt or chromium, nickel and nickel alloys, and other metallic materials.

1.3 The general chemical, physical, and mechanical property requirements of these materials are covered by other ASTM specifications (specifically Specifications B103/B103M, B122/B122M, B152/B152M, B162, B465, F15, F30, F31, and F68), and these should be consulted for properties and tempers that are different for the different metals. For metals for which no ASTM specification is available, other specifications should be adopted by agreement of the parties concerned.

1.4 TThe values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

ICS
31.240 Mechanical structures for electronic equipment / Механические конструкции электронного оборудования
Сборник ASTM
10.04 Electronics; Declarable Substances in Materials; 3D Imaging Systems; Additive Manufacturing Technologies / Электроника; Декларируемые вещества в материалах; Системы 3D-визуализации; Аддитивные технологии производства
Тематика
Electronics