This specification covers aluminum-1 % silicon alloy wire for semiconductor devices lead-bonding and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). The wire surface shall be clean and free of finger oils, lubricant residues, stains, and particulate matter. The elongation and breaking load shall be tested to meet the requirements prescribed. The methods in determining the wire dimensions are presented in details. Verify that the chemical requirements are satisfied by means of spectrographic analysis.

1.1 This specification covers aluminum–1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters larger than 76 μm (0.003 in.), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in SI units are to be regarded as the standard, regardless of whether they appear first or second in a table. Values given in parentheses are for information only.