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ASTM
ASTM F533-02a
Отменен
Standard Test Method for Thickness and Thickness Variation of Silicon Wafers (Withdrawn 2003)
— 5 стр.
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Ссылочные документы
ASTM F533-02a
Отменен
Standard Test Method for Thickness and Thickness Variation of Silicon Wafers (Withdrawn 2003)
— 5 стр.
ASTM F533-02
Заменен
Standard Test Method for Thickness and Thickness Variation of Silicon Wafers
— 4 стр.
На этот документ ссылаются
BS EN 62276:2005
Заменен
Single crystal wafers applied for surface acoustic wave (SAW) device applications. Specification and measuring methods
— 38 стр.
BS EN 62276:2013
Заменен
Single crystal wafers for surface acoustic wave (SAW) device applications. Specifications and measuring methods
— 44 стр.
BS EN 62276:2016
Действует
Single crystal wafers for surface acoustic wave (SAW) device applications. Specifications and measuring methods
— 44 стр.
ASTM F533-02
Заменен
Standard Test Method for Thickness and Thickness Variation of Silicon Wafers
— 4 стр.
ASTM F533-02a
Отменен
Standard Test Method for Thickness and Thickness Variation of Silicon Wafers (Withdrawn 2003)
— 5 стр.