Стандарты ASTM

ASTM F72-06

Заменен

Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2015) — 11 стр.

Описание Ссылки Версии

Ссылочные документы

ASTM F205-94(2010)e1

Заменен

Standard Test Method for Measuring Diameter of Fine Wire by Weighing — 3 стр.

ASTM F219-96(2013)

Заменен

Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps — 3 стр.

ASTM F584-06e1

Отменен

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015) — 7 стр.

ASTM E16-64 (1971)

Отменен

Method of Free Bend Test for Ductility of Welds (Withdrawn 1978) — 3 стр.

ASTM F72-06

Заменен

Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2015) — 11 стр.

ASTM F72-17

Заменен

Standard Specification for Gold Wire for Semiconductor Lead Bonding — 11 стр.

ASTM F72-95(2001)

Заменен

Standard Specification for Gold Wire for Semiconductor Lead Bonding — 13 стр.

На этот документ ссылаются

ASTM F584-06

Заменен

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire — 7 стр.

ASTM F584-87(2005)

Заменен

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire — 7 стр.

ASTM F584-87(1999)

Заменен

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire — 7 стр.

ASTM F487-88(1995)e1

Заменен

Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding — 3 стр.

ASTM F487-88(2001)

Заменен

Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding — 3 стр.

ASTM F487-88(2006)

Заменен

Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding — 4 стр.

ASTM F72-17

Заменен

Standard Specification for Gold Wire for Semiconductor Lead Bonding — 11 стр.

ASTM F72-95(2001)

Заменен

Standard Specification for Gold Wire for Semiconductor Lead Bonding — 13 стр.

ASTM F72-06

Заменен

Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2015) — 11 стр.