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ASTM F744M-16

Отменен
Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric) (Withdrawn 2023) — 7 стр.
Причина отмены This test method covered the measurement of the threshold level of radiation dose rate that causes upset in digital integrated circuits only under static operating conditions. The radiation source is either a flash X-ray machine (FXR) or an electron linear accelerator (LINAC).

Formerly under the jurisdiction of F01 on Electronics, this test method was withdrawn in November 2023. This standard is being withdrawn without replacement because Committee F01 was disbanded.

Значение и использование

5.1 Digital integrated circuits are specified to operate with their inputs and outputs in either a logical 1 or a logical 0 state. The occurrence of signals having voltage levels not meeting the specifications of either of these levels (an upset condition) may cause the generation and propagation of erroneous data in a digital system.

5.2 Knowledge of the radiation dose rate that causes upset in digital integrated circuits is essential for the design, production, and maintenance of electronic systems that are required to operate in the presence of pulsed radiation environments.

Область применения

1.1 This test method covers the measurement of the threshold level of radiation dose rate that causes upset in digital integrated circuits only under static operating conditions. The radiation source is either a flash X-ray machine (FXR) or an electron linear accelerator (LINAC).

1.2 The precision of the measurement depends on the homogeneity of the radiation field and on the precision of the radiation dosimetry and the recording instrumentation.

1.3 The test may be destructive either for further tests or for purposes other than this test if the integrated circuit being tested absorbs a total radiation dose exceeding some predetermined level. Because this level depends both on the kind of integrated circuit and on the application, a specific value must be agreed upon by the parties to the test (6.8).

1.4 Setup, calibration, and test circuit evaluation procedures are included in this test method.

1.5 Procedures for lot qualification and sampling are not included in this test method.

1.6 Because of the variability of the response of different device types, the initial dose rate and device upset conditions for any specific test is not given in this test method but must be agreed upon by the parties to the test.

1.7 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

1.8 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

ICS
31.200 Integrated. Including electronic chips, logical and analogue microstructures / Интегральные схемы. Микроэлектроника. Включая электронные микросхемы, логические и аналоговые микроструктуры
Сборник ASTM
10.04 Electronics; Declarable Substances in Materials; 3D Imaging Systems; Additive Manufacturing Technologies / Электроника; Декларируемые вещества в материалах; Системы 3D-визуализации; Аддитивные технологии производства
Тематика
Electronics