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18/30380709 DC

Действует
BS EN IEC 62025-2. High frequency inductive components. Non-electrical characteristics and measuring methods. Part 2. Test methods for non-electrical characteristics — 28 стр.
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Ссылочные документы

IEC 61190-1-3:2007 ed2.0
Заменен
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 71 стр.
IEC 60068-2-27:1967 ed1.0
Заменен
Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test Ea: Shock — 17 стр.
IEC 60068-2-21:2006/COR1:2012 ed6.0
Заменен
Corrigendum 1 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices — 0 стр.
IEC 60068-2-60:2015 RLV ed3.0
Действует
Environmental testing - Part 2-60: Tests - Test Ke: Flowing mixed gas corrosion test — 58 стр.
IEC 60068-2-77:1999 ed1.0
Заменен
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock — 21 стр.
IEC 60068-2-20A:1970 ed1.0
Заменен
Supplement A - Basic environmental testing procedures - Part 2: Tests - Test T: Soldering - Test Tb: Resistance to soldering heat, Method 1 — 4 стр.
IEC 62211:2003 ed1.0
Заменен
Inductive components - Reliability management — 29 стр.
IEC 61188-5-2:2003 ed1.0
Действует
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components — 103 стр.
IEC 60068-2-69:2017/COR1:2018 ed3.0
Действует
Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) — 6 стр.
IEC 60068-2-58:2015 ed4.0
Действует
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 75 стр.
IEC 61190-1-2:2007 ed2.0
Заменен
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly — 37 стр.
IEC 60068-2-45:1980/AMD1:1993 ed1.0
Действует
Amendment 1 - Basic environmental testing procedures - Part 2-45: Tests - Test XA and guidance: Immersion in cleaning solvents — 2 стр.
IEC 60068-1:2013 ed7.0
Действует
Environmental testing - Part 1: General and guidance — 62 стр.