Sampling procedures for inspection by attributes. Part 1. Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection— 94 стр.
Rule of Procedure 8. Attestation of conformity. The CECC Mark and conditions of use, certificates of approval and procedures for the attestation of conformity— 54 стр.
Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly— 22 стр.
Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly— 28 стр.
Base materials for printed circuits. Part 2: Specifications. Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality— 21 стр.
Rules of procedure of the IEC quality assessment system for electronic components (IECQ), Approval procedures, including a new clause on technology approval— 18 стр.
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections— 34 стр.
