Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly— 22 стр.
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Reinforced base materials clad and unclad. Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad— 26 стр.
Base materials for printed circuits. Part 2: Specifications. Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)— 23 стр.
Base materials for printed circuits. Part 2: Specifications. Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)— 23 стр.
Amendment No. 2 - Base materials for printed circuits. Part 2: Specifications. Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)— 7 стр.
