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BS 123700-003:2001

Действует
System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections — 26 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

BS 123200:2001
Действует
System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes — 16 стр.
BS 123000:2001
Действует
System of quality assessment. Generic specification. Printed boards — 42 стр.
IEC 60326-2:1990 ed3.0
Отменен
Printed boards. Part 2: Test methods — 121 стр.
BS EN 123000:1992
Действует
Harmonized system of quality assessment for electronic components. Generic specification: printed boards — 40 стр.
BS 6221-2:1991
Отменен
Printed wiring boards, Methods of test — 78 стр.
IEC 60194:1988/COR1:1990 ed3.0
Заменен
Corrigendum 1 - Terms and definitions for printed circuits — 1 стр.
BS 4584-103.1:1990
Отменен
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits, Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board — 12 стр.
IEC 60068-2-54:2006 ed2.0
Заменен
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method — 37 стр.
IEC 60068-2-33:1971 ed1.0
Заменен
Environmental testing - Part 2: Tests. Guidance on change of temperature tests — 13 стр.
IEC 60249-2-15:1987 ed1.0
Отменен
Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability — 23 стр.
IEC 60249-2-13:1987 ed1.0
Заменен
Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade — 23 стр.
IEC 60249-2-12:1987/AMD3:1994 ed2.0
Заменен
Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards — 5 стр.
IEC 60249-2-11:1987 ed1.0
Отменен
Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards — 17 стр.
IEC 60249-2-8:1987 ed1.0
Отменен
Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film — 19 стр.
BS 123700:2001
Действует
System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections — 26 стр.
BS 123500-003:2001
Действует
System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections — 36 стр.

На этот документ ссылаются

BS 123700:2001
Действует
System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections — 26 стр.