Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits, Specification for copper foil for use in the manufacture of copper-clad base materials— 14 стр.
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections— 16 стр.
Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes— 32 стр.
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections— 18 стр.
Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections— 30 стр.
Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections— 34 стр.
Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes— 26 стр.
