Specification for metal-clad base materials for printed circuits, Bonding sheet material for use in the fabrication of multilayer printed boards: EP-GC-11— 13 стр.
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits, Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board— 12 стр.
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits, Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board— 12 стр.
