Sampling procedures for inspection by attributes, Introduction to the BS 6001 (ISO 2859) series of standards for sampling for inspection by attributes— 20 стр.
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: fixed capacitors with metallized electrodes and polypropylene dielectric— 18 стр.
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: directly heated negative temperature coefficient thermistors (rod type)— 20 стр.
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: directly heated negative temperature coefficient thermistors (disc type)— 20 стр.
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: directly heated negative temperature coefficient thermistors (beads in envelopes)— 20 стр.
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: directly heated negative temperature coefficient thermistors (beads in solid glass or vitreous enamel)— 20 стр.
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: fixed metallized polyethylene terephthalate film dielectric d.c. capacitors— 18 стр.
Harmonized system of quality assessment for electronic components. Blank detail specification. Adjusters used with magnetic oxide (ferrite) cores for use in inductors and tuned transformers— 12 стр.
Specification for harmonized system of quality assessment for electronic components. Fixed resistors for use in electronic equipment. Blank detail specification: fixed power resistors. Assessment level E— 12 стр.
Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Mercury wetted make contact units for general application— 26 стр.
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: film and hybrid integrated circuits (capability approval)— 24 стр.
Detail specification for cold welded seal quartz crystal units for oscillator applications. DN, 47 U/2, DQ and DP enclosures, 0.8 to 20 MHz and 3.0 to 30 MHz frequency ranges. Fundamental thickness-shear mode, AT-cut, for operation over wide temperature ranges (non-temperature controlled). Full assessment level— 16 стр.
Sampling procedures for inspection by variables, General guide to single sampling plans indexed by acceptance quality limit (AQL) for lot-by-lot inspection of independent quality characteristics— 96 стр.
Detail specification for resistance welded seal quartz crystal units for oscillator applications. DN, DZ, DQ and DP enclosures, 17 to 75 MHz frequency range. Third overtone thickness-shear mode, AT-cut, for operation over wide temperature ranges (non-temperature controlled). Full assessment level— 12 стр.
Specification for powder organic coatings for application and stoving to hot-dip galvanized hot-rolled steel sections and preformed steel sheet for windows and associated external architectural purposes, and for the finish on galvanized steel sections and preformed sheet coated with powder organic coatings— 18 стр.
Detail specification for multi-contact circular electrical connectors for d.c. and low frequency applications. Bayonet couplingnon-barrier sealed, environment resistant with rear insertable, rear release, rear removable crimp contacts also barrier sealedwith non-removable solder contact styles. Full plus airframe fit assessment— 126 стр.
Detail specification for resistance welded seal quartz crystal units for oscillator applications. DN, DZ, DQ and DP enclosures, 50 to 125 MHz frequency range. Fifth overtone thickness-shear mode, AT-cut, for operation over narrow temperature ranges (temperature controlled). Full assessment level— 12 стр.
Detail specification for resistance welded seal quartz crystal units for oscillator applications. DN, DZ, DQ and DP enclosures, 0.8 to 20 MHz and 3.0 to 30 MHz frequency ranges. Fundamental thickness-shear mode, AT-cut, for operation over wide temperature ranges (non-temperature controlled). Full assessment level— 14 стр.
Specification for powder organic coatings for application and stoving to aluminium alloy extrusions, sheet and preformed sections for external architectural purposes, and for the finish on aluminium alloy extrusions, sheet and preformed sections coated with powder organic coatings— 18 стр.
Detail specification for cold welded seal quartz crystal units for oscillator applications. DN, 47 U/2, DQ and DP enclosures, 17 to 75 MHz frequency range. Third overtone thickness-shear mode, AT-cut, for operation over wide temperature ranges (non-temperature controlled). Full assessment level— 14 стр.
Detail specification for silicon voltage regulator diodes. 400 mW, 2.7 to 33 V (5%), hermetically sealed, glass encapsulation. General application category Q— 14 стр.
Detail specification for cold welded seal quartz crystal units for oscillator applications. DN, DQ and DP enclosures, 50 to 125 MHz frequency range. Fifth overtone thickness-shear mode, AT-cut, for operation over wide temperature ranges (non-temperature controlled). Full assessment level— 12 стр.
Detail specification for cold welded seal quartz crystal units for oscillator applications. DK enclosure, 6.0 to 25 MHz frequency range. Fundamental thickness-shear mode, AT-cut, for operation over wide temperature ranges (non-temperature controlled). Full assessment level— 12 стр.
Specification for electrical connectors of assessed quality for d.c. and low frequency application: generic data, methods of test and capability approval procedures— 94 стр.
Detail specification for resistance welded seal quartz crystal units for oscillator applications. DN, DZ, DQ and DP enclosures, 0.8 to 20 MHz and 3.0 to 30 MHz frequency ranges. Fundamental thickness-shear mode, AT-cut, for operation over narrow temperature ranges (temperature controlled). Full assessment level— 14 стр.
Sampling procedures for inspection by variables, Guide to single sampling plans indexed by acceptance quality limit (AQL) for lot-by-lot inspection for a single quality characteristic and a single AQL— 118 стр.
Detail specification for cold welded seal quartz crystal units for oscillator applications. DN, DQ and DP enclosures, 0.8 to 20 MHz and 3.0 to 30 MHz frequency ranges. Fundamental thickness-shear mode, AT-cut, for operation over narrow temperature ranges (temperature controlled). Full assessment level— 12 стр.
Detail specification for resistance welded seal quartz crystal units for oscillator applications. DN, DZ, DQ and DP enclosures, 50 to 125 MHz frequency range. Fifth overtone thickness-shear mode, AT-cut, for operation over wide temperature ranges (non-temperature controlled). Full assessment level— 12 стр.
Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures). Generic data and methods of test— 154 стр.
Detail specification for resistance welded seal quartz crystal units for oscillator applications. DN, DZ, DQ and DP enclosures, 17 to 75 MHz frequency range. Third overtone thickness-shear mode, AT-cut, for operation over narrow temperature ranges (temperature controlled). Full assessment level— 12 стр.
Detail specification for cold welded seal quartz crystal units for oscillator applications. DN, DQ and DP enclosures, 50 to 125 MHz frequency range. Fifth overtone thickness-shear mode, AT-cut, for operation over narrow temperature ranges (temperature controlled). Full assessment level— 12 стр.
