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BS EN 123600:1997

Отменен
Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections — 50 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60097:1967 ed2.0
Заменен
Fundamental parameters for printed wiring techniques — 4 стр.
IEC 60068-2-83:2011 ed1.0
Действует
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste — 76 стр.
BS EN 123000:1992
Действует
Harmonized system of quality assessment for electronic components. Generic specification: printed boards — 40 стр.
BS 6221-3:1991
Отменен
Printed wiring boards, Guide for the design and use of printed wiring boards — 48 стр.
BS 6221-24:1992
Отменен
Printed wiring boards, Guide for the production of artwork — 18 стр.
BS 2011-2.1T:1981
Заменен
Environmental testing. Tests, Test T. Soldering — 22 стр.
IEC 60326-11:1991 ed1.0
Отменен
Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections — 59 стр.
IEC 60326-1:1984 ed1.0
Заменен
Printed boards - Part 1: General information for the specification writer — 19 стр.
IEC 60249-2-13:1987 ed1.0
Заменен
Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade — 23 стр.
BS 9766:1983
Заменен
Specification for printed circuits of assessed quality: sectional specification for multilayer flexi-rigid printed circuits with through hole connections — 42 стр.

На этот документ ссылаются

BS 9766:1983
Заменен
Specification for printed circuits of assessed quality: sectional specification for multilayer flexi-rigid printed circuits with through hole connections — 42 стр.