BS EN 123800:1997

Отменен

Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections — 50 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

IEC 60097:1967 ed2.0

Заменен

Fundamental parameters for printed wiring techniques — 4 стр.

IEC 60068-2-83:2011 ed1.0

Действует

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste — 76 стр.

BS EN 123000:1992

Действует

Harmonized system of quality assessment for electronic components. Generic specification: printed boards — 40 стр.

BS 6221-3:1991

Отменен

Printed wiring boards, Guide for the design and use of printed wiring boards — 48 стр.

BS 6221-24:1992

Отменен

Printed wiring boards, Guide for the production of artwork — 18 стр.

BS 2011-2.1T:1981

Заменен

Environmental testing. Tests, Test T. Soldering — 22 стр.

IEC 60326-9:1991 ed1.0

Отменен

Printed boards - Part 9: Specification for flexible multilayer printed boards with through connections — 63 стр.

IEC 60326-1:1984 ed1.0

Заменен

Printed boards - Part 1: General information for the specification writer — 19 стр.

IEC 60249-2-13:1987 ed1.0

Заменен

Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade — 23 стр.