Environmental testing. Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method— 28 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 42 стр.
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 75 стр.
IEC Quality Assessment System for Electronic Components (IECQ System) - IECQ Guide - Guidance for the use of the IECQ Logo and IECQ Mark of Conformity - <a href="http://www.iec.ch/webstore/freepubs/iecq/iecq01A{ed2.0}en.pdf">FREE DOWNLOAD</a>— 8 стр.