Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 30 стр.
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly— 41 стр.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 71 стр.
Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method— 58 стр.
Environmental testing. Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method— 28 стр.
Printed boards and printed board assemblies. Design and use. Attachment (land/joint) considerations. Components with gull- wing leads on four sides— 46 стр.
Fixed capacitors for use in electronic equipment. Sectional specification. Aluminium electrolytic capacitors with solid (MnO$d2) and non-solid electrolyte— 40 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 42 стр.
Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method— 58 стр.
Environmental testing. Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 46 стр.
Environmental testing, Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method— 60 стр.
Connectors for electronic equipment - Product requirements -- Part 4-116: Printed board connectors - Detail specification for a high-speed two-part connector with integrated shielding function ( IEC 61076-4-116:2012) (english version)
