Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste— 76 стр.
Surface chemical analysis. Secondary ion mass spectrometry. Correction method for saturated intensity in single ion counting dynamic secondary ion mass spectrometry— 24 стр.
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 2: Seismic tests for cabinets and racks (IEC 61587-2:2011) (english version)
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks and plug-in units (IEC 61587-5:2013) (english version)