Environmental testing. Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste— 40 стр.
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 75 стр.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 71 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 42 стр.
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 38 стр.
Harmonized system of quality assessment for electronic components. Generic specification. Sockets for use with electrical relays of assessed quality— 36 стр.
Classification of environmental conditions. Environmental conditions appearing in nature. Measured shock and vibration data. Storage, transportation and in-use— 20 стр.
Industrial communication networks. Profiles. Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)— 40 стр.
