Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 42 стр.
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 75 стр.
Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method— 58 стр.
Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)— 6 стр.
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad— 24 стр.
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad— 41 стр.
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad— 49 стр.
Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly— 28 стр.
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly— 46 стр.
Fixed film resistor networks for use in electronic equipment. Blank detail specification for film resistor networks of assessed quality on the basis of the capability approval procedure. Assessment level E— 18 стр.
Harmonized system of quality assessment for electronic components. Fixed film resistor networks for use in electronic equipment. Sectional specification for film resistor networks of assessed quality on the basis of the capability approval procedure— 56 стр.
Harmonized system of quality assessment for electronic components. Fixed film resistor networks for use in electronic equipment. Generic specification— 48 стр.
Harmonized system of quality assessment for electronic components. Fixed film resistor networks for use in electronic equipment. Generic specification— 48 стр.
Fixed film resistor networks for use in electronic equipment. Blank detail specification for film resistor networks of assessed quality on the basis of the capability approval procedure. Assessment level E— 18 стр.
Harmonized system of quality assessment for electronic components. Fixed film resistor networks for use in electronic equipment. Sectional specification for film resistor networks of assessed quality on the basis of the capability approval procedure— 56 стр.