Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 53 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 30 стр.
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad— 41 стр.
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad— 24 стр.
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly— 37 стр.