Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages— 26 стр.
Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages— 42 стр.
Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages— 26 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)— 16 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)— 16 стр.
Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages— 26 стр.
Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages— 42 стр.
Fibre optic active components and devices. Package and interface standards. 40-Gbit/s serial transmitter and receiver components for use with the LC connector interface— 38 стр.
Fibre optic active components and devices. Package and interface standards. Transmitter and receiver components for use with LC connector interface— 36 стр.
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010) (english version)
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010) (english version)
