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BS EN 60191-6-20:2010

Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ) — 16 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

BS EN 60191-6-8:2001
Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP) — 14 стр.
BS EN 60191-4:2014
Заменен
Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages — 26 стр.
IEC 60191-6-18:2010/COR2:2010 ed1.0
Действует
Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) — 1 стр.
IEC 60191-4:1999 ed2.0
Заменен
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages — 39 стр.