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BS EN 60191-6-21:2010

Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP) — 16 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

BS EN 60191-6-8:2001
Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP) — 14 стр.
BS EN 60191-4:2014
Заменен
Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages — 26 стр.
IEC 60191-6-18:2010/COR2:2010 ed1.0
Действует
Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) — 1 стр.
IEC 60191-4:1999 ed2.0
Заменен
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages — 39 стр.