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BS EN 60191-6-8:2001

Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP) — 14 стр.
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Ссылочные документы

BS EN 60191-6-8:2001
Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP) — 14 стр.
BS IEC 60191-2:1966
Действует
Mechanical standardization of semiconductor devices. Dimensions — 1052 стр.

На этот документ ссылаются

BS EN 62258-1:2010
Действует
Semiconductor die products. Procurement and use — 46 стр.
BS EN 62149-2:2014
Действует
Fibre optic active components and devices. Performance standards. 850 nm discrete vertical cavity surface emitting laser devices — 24 стр.
BS EN 61240:2017
Действует
Piezoelectric devices. Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection. General rules — 22 стр.
BS EN 60191-6-10:2003
Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages — 16 стр.
BS EN 60191-6-8:2001
Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP) — 14 стр.
BS EN 60191-6-6:2001
Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine pitch land grid array (FLGA) — 16 стр.
BS EN 60191-6-21:2010
Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP) — 16 стр.
BS EN 60191-6-20:2010
Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ) — 16 стр.
BS EN 60191-6-2:2002
Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages — 14 стр.
BS EN 60191-6-18:2010
Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA) — 24 стр.
BS EN 60191-6-17:2011
Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) — 32 стр.
BS EN 60191-6-13:2016
Действует
Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) — 22 стр.
BS EN 60191-6-12:2011
Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA) — 24 стр.
BS EN IEC 62148-1:2018
Действует
Fibre optic active components and devices. Package and interface standards. General and guidance — 16 стр.