BS EN 60286-4:2013

Действует

Packaging of components for automatic handling. Stick magazines for electronic components encapsulated in packages of different forms — 18 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

ISO 11469:2000

Заменен

Plastics. General indentification and marking of plastics products — 8 стр.

IEC 60191-3:1999 ed2.0

Действует

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits — 113 стр.

BS IEC 60747-1:2006

Действует

Semiconductor devices. General — 46 стр.

BS IEC 60191-2:1966

Действует

Mechanical standardization of semiconductor devices. Dimensions — 1052 стр.

BS EN 60286-4:1998

Заменен

Packaging of components for automatic handling. Stick magazines for electronic components encapsulated in packages of form E and G — 16 стр.

На этот документ ссылаются

BS EN 60286-4:1998

Заменен

Packaging of components for automatic handling. Stick magazines for electronic components encapsulated in packages of form E and G — 16 стр.

BS EN 61760-3:2010

Действует

Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering — 28 стр.

ÖVE/ÖNORM EN 61760-3:2011-01

Действует

Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010) (english version)