Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Cyanate ester non-woven aramid laminate of defined flammability, copper-clad— 20 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards)— 122 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures— 128 стр.
Insulation coordination for equipment within low-voltage systems. Comprehensive method for determining clearances and creepage distances equal to or less than 2 mm— 48 стр.
Specifications for pressure-sensitive adhesive tapes for electrical purposes. Specifications for individual materials. PVC film tapes with pressure-sensitive adhesive— 12 стр.
Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly— 22 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 241 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures— 122 стр.
Insulation coordination for equipment within low-voltage systems - Part 5: Comprehensive method for determining clearances and creepage distances equal to or less than 2 mm— 93 стр.
Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive— 15 стр.
