Стандарты BSI

BS EN 61192-4:2003

Действует

Workmanship requirements for soldered electronic assemblies. Terminal assemblies — 34 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

BS EN 61192-3:2003

Действует

Workmanship requirements for soldered electronic assemblies. Through-hole mount assemblies — 50 стр.

BS EN 61192-1:2003

Действует

Workmanship requirements for soldered electronic assemblies. General — 78 стр.

IEC 61192-3:2002 ed1.0

Отменен

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies — 93 стр.

IEC 61192-2:2003 ed1.0

Отменен

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies — 127 стр.

IEC 61192-1:2003 ed1.0

Отменен

Workmanship requirements for soldered electronic assemblies - Part 1: General — 147 стр.

IEC 61191-4:1998 ed1.0

Заменен

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies — 33 стр.

IEC 61191-1:1998 ed1.0

Заменен

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies — 89 стр.

IEC 61189-3:1997 ed1.0

Заменен

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) — 105 стр.

IEC 60749:1996 ed2.0

Заменен

Semiconductor devices - Mechanical and climatic test methods — 95 стр.

IEC 60194:1988/COR1:1990 ed3.0

Заменен

Corrigendum 1 - Terms and definitions for printed circuits — 1 стр.