Acceptance sampling procedures based on the allocation of priorities principles (APP). Coordinated single sampling plans for acceptance sampling by attributes— 60 стр.
Sampling procedures for inspection by variables -- Part 5: Sequential sampling plans indexed by acceptance quality limit (AQL) for inspection by variables (known standard deviation)— 44 стр.
Sampling procedures for inspection by variables -- Part 3: Double sampling schemes indexed by acceptance quality limit (AQL) for lot-bylot inspection— 122 стр.
Sampling procedures for inspection by variables. General specification for single sampling plans indexed by acceptance quality limit (AQL) for lot-by-lot inspection of independent quality characteristics— 98 стр.
Sampling procedures for inspection by variables. Specification for single sampling plans indexed by acceptance quality limit (AQL) for lot-by-lot inspection for a single quality characteristic and a single AQL— 106 стр.
Sampling procedures for inspection by attributes -- Part 10: introduction to the ISO 2859 series of standards for sampling for inspection by attributes— 18 стр.
Sampling procedures for inspection by attributes -- Part 5: System of sequential sampling plans indexed by acceptance quality limit (AQL) for lot-bylot inspection— 50 стр.
Sampling procedures for inspection by attributes. Part 1. Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection— 94 стр.
Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad— 42 стр.
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 105 стр.
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures— 139 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.
