Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 76 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 42 стр.
Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections. Hybrid enclosure outlines— 18 стр.
Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections. Ceramic enclosures— 104 стр.
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections -- Part 4: Hybrid enclosure outlines (IEC 61837-4:2015) (english version)