Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP)— 14 стр.
Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)— 1 стр.
Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections. Ceramic enclosures— 90 стр.