Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings. Copper foils (for the manufacture of copper-clad base materials)— 26 стр.
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)— 39 стр.
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures— 139 стр.
Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability— 16 стр.
