Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods and methodology— 26 стр.
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 105 стр.
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures— 139 стр.
Recommended methods for the determination of the permittivity and dielectric dissipation factor of electrical insulating materials at power, audio and radio frequencies including metre wavelengths— 56 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.