Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections. Ceramic enclosures— 90 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 42 стр.
Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections, Ceramic enclosures— 42 стр.
Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections. Ceramic enclosures— 90 стр.